What Metalloid Is Used to Make Computer Chips?

Modern computing relies on the computer chip, which contains billions of transistors that process and store data. The physical complexity of these circuits requires building blocks with specialized electrical properties. This led to the use of metalloids, a unique class of elements that are neither fully metal nor fully nonmetal.

What Exactly Is a Metalloid?

Metalloids are elements found along the “stair-step” line separating metals from nonmetals on the periodic table. They exhibit properties intermediate between the two groups, often possessing a metallic luster but being brittle solids. Key examples include Boron, Germanium, Arsenic, Antimony, and Tellurium. The metalloid central to modern computer chips is Silicon (atomic number 14). Situated in Group 14, Silicon has four valence electrons, meaning it behaves neither as a perfect conductor nor as a perfect insulator.

The Crucial Role of Silicon in Electronics

Silicon’s utility in electronics stems from its classification as a semiconductor, meaning its ability to conduct electricity can be precisely controlled. In its pure, crystalline form, silicon is a poor conductor because electrons are tightly bound in the lattice structure. This intrinsic property allows manufacturers to manipulate its electrical behavior through doping.

Doping involves introducing trace impurities into the silicon crystal structure to create an excess or deficiency of electrons. Adding Group 15 elements, such as Phosphorus (five valence electrons), results in an extra free electron, creating an N-type semiconductor (negative charge carrier). Conversely, adding Group 13 elements, such as Boron (three valence electrons), creates an electron vacancy or “hole,” resulting in a P-type semiconductor (positive charge carrier).

Creating adjacent regions of N-type and P-type materials forms the basis of a transistor, the fundamental switch in a computer chip. This arrangement allows the material to act as a gate, switching electrical current flow on or off based on an applied voltage. Silicon’s ability to form a stable, high-quality insulating layer (silicon dioxide) solidified its position as the preferred semiconductor. This property enables the construction of the metal-oxide-semiconductor field-effect transistor (MOSFET).

How Silicon Becomes a Substrate

The journey from raw silica (quartz sand) to a functional computer chip substrate requires a highly controlled, multi-step purification process. First, common quartz sand is refined into metallurgical-grade silicon (about 98% pure). This material is then chemically refined further to produce electronic-grade silicon (EGS). EGS must exceed 99.9999999% purity to be suitable for chip fabrication.

The EGS, which is polycrystalline, is melted in a crucible at a temperature exceeding 1,420 degrees Celsius. This molten material is used in the Czochralski process. A small, precisely oriented single-crystal silicon rod, known as a seed crystal, is dipped into the melt. As the seed crystal is slowly withdrawn, silicon atoms solidify onto the seed, adopting its perfect, single-crystal orientation.

This process results in a large, cylindrical ingot (or boule) of single-crystal silicon, which can weigh over 100 kilograms. The ingot is then precisely sliced into thin discs, called wafers. These wafers are meticulously polished to an atomically flat surface and serve as the foundational substrate for building transistors and circuits through subsequent layering and etching.

Other Key Materials in Modern Chips

While silicon forms the substrate of most integrated circuits, modern chip performance relies on a complex blend of other specialized materials. As transistors continue to shrink, traditional silicon dioxide insulators become so thin that electrical current “tunnels” through, causing power leakage. This problem is mitigated by using high-k dielectric materials, which possess a high dielectric constant (kappa) and can provide the same electrical insulation with a physically thicker layer.

Hafnium dioxide and Zirconium dioxide are common examples of high-k materials used to replace silicon dioxide in the gate stack of advanced transistors. Additionally, compound semiconductors, which combine two or more elements, are used for specialized high-performance applications. Gallium Arsenide, for instance, is preferred over silicon in high-frequency applications like 5G communication due to its superior electron mobility.

Other materials, such as Copper, are used for the microscopic wiring, or interconnects, that link the billions of transistors on the chip. The continuous drive to increase computational speed and decrease power consumption ensures that material scientists are constantly exploring alternatives, including Germanium and emerging carbon-based structures.